Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9827740 | Polyimides as laser release materials for 3-D IC applications | Dongshun Bai, Tony D. Flaim, Xing-Fu Zhong, Qi Wu | 2017-11-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9827740 | Polyimides as laser release materials for 3-D IC applications | Dongshun Bai, Tony D. Flaim, Xing-Fu Zhong, Qi Wu | 2017-11-28 |