Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728510 | Cavity package with composite substrate | Dipak Sengupta | 2017-08-08 |
| 9698127 | Integrated device die and package with stress reduction features | Thomas M. Goida | 2017-07-04 |