Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698127 | Integrated device die and package with stress reduction features | Xiaojie Xue | 2017-07-04 |
| 9573800 | Pre-molded MEMS device package having conductive column coupled to leadframe and cover | — | 2017-02-21 |
| 9533878 | Low stress compact device packages | Kathleen O'Donnell, Michael D. Delaus | 2017-01-03 |