Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9731959 | Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same | Shafi Saiyed | 2017-08-15 |
| 9728510 | Cavity package with composite substrate | Xiaojie Xue | 2017-08-08 |
| 9716193 | Integrated optical sensor module | — | 2017-07-25 |