Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9731959 | Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same | Dipak Sengupta | 2017-08-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9731959 | Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same | Dipak Sengupta | 2017-08-15 |