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Dong Hyun Bang

AT Amkor Technology: 1 patents #48 of 116Top 45%
Overall (2017): #438,648 of 506,227Top 90%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9809446 Semiconductor package and manufacturing method thereof Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo +2 more 2017-11-07