Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768103 | Fabrication method of embedded chip substrate | Yung-Hui Wang | 2017-09-19 |
| 9728451 | Through silicon vias for semiconductor devices and manufacturing method thereof | Chen-Chao Wang | 2017-08-08 |
| 9711473 | Semiconductor die, semiconductor wafer and method for manufacturing the same | Chin-Cheng Kuo, Lu-Ming Lai | 2017-07-18 |