Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728451 | Through silicon vias for semiconductor devices and manufacturing method thereof | Ying-Te Ou | 2017-08-08 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728451 | Through silicon vias for semiconductor devices and manufacturing method thereof | Ying-Te Ou | 2017-08-08 |