Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824924 | Semiconductor packages having an electric device with a recess | Kim-Yong Goh, Xueren Zhang | 2017-11-21 |
| 9679870 | Integrated circuit device with shaped leads and method of forming the device | Kim-Yong Goh, Xueren Zhang, Wei Zhen Goh | 2017-06-13 |
| 9576912 | Wafer level chip scale package (WLCSP) having edge protection | Kim-Yong Goh, Xueren Zhang | 2017-02-21 |