Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824924 | Semiconductor packages having an electric device with a recess | Kim-Yong Goh, Yiyi Ma | 2017-11-21 |
| 9679870 | Integrated circuit device with shaped leads and method of forming the device | Yiyi Ma, Kim-Yong Goh, Wei Zhen Goh | 2017-06-13 |
| 9620438 | Electronic device with heat dissipater | Roseanne Duca, Valter Motta, Kim-Yong Goh | 2017-04-11 |
| 9576912 | Wafer level chip scale package (WLCSP) having edge protection | Yiyi Ma, Kim-Yong Goh | 2017-02-21 |