Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478496 | Wafer to wafer structure and method of fabricating the same | — | 2016-10-25 |
| 9437491 | Method of forming chip with through silicon via electrode | Chu-Fu Lin, Chien-Li Kuo, Yung-Chang Lin | 2016-09-06 |
| 9412686 | Interposer structure and manufacturing method thereof | Kuei-Sheng Wu, Chien-Li Kuo | 2016-08-09 |
| 9343359 | Integrated structure and method for fabricating the same | Chun-Hung Chen, Yung-Chang Lin, Chien-Li Kuo | 2016-05-17 |
| 9287173 | Through silicon via and process thereof | Chien-Li Kuo, Chun-Hung Chen, Yung-Chang Lin | 2016-03-15 |