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Semiconductor package structure and method for manufacturing the same |
— |
2016-10-25 |
| 9466560 |
Interposer fabricating process and wafer packaging structure |
— |
2016-10-11 |
| 9437491 |
Method of forming chip with through silicon via electrode |
Ming-Tse Lin, Chu-Fu Lin, Yung-Chang Lin |
2016-09-06 |
| 9412686 |
Interposer structure and manufacturing method thereof |
Ming-Tse Lin, Kuei-Sheng Wu |
2016-08-09 |
| 9343359 |
Integrated structure and method for fabricating the same |
Chun-Hung Chen, Ming-Tse Lin, Yung-Chang Lin |
2016-05-17 |
| 9287173 |
Through silicon via and process thereof |
Chun-Hung Chen, Ming-Tse Lin, Yung-Chang Lin |
2016-03-15 |
| 9275933 |
Semiconductor device |
Yung-Chang Lin |
2016-03-01 |
| 9269645 |
Fan-out wafer level package |
Chu-Fu Lin, Kuo-Ming Chen |
2016-02-23 |