Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437491 | Method of forming chip with through silicon via electrode | Ming-Tse Lin, Chien-Li Kuo, Yung-Chang Lin | 2016-09-06 |
| 9269645 | Fan-out wafer level package | Chien-Li Kuo, Kuo-Ming Chen | 2016-02-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437491 | Method of forming chip with through silicon via electrode | Ming-Tse Lin, Chien-Li Kuo, Yung-Chang Lin | 2016-09-06 |
| 9269645 | Fan-out wafer level package | Chien-Li Kuo, Kuo-Ming Chen | 2016-02-23 |