Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9499399 | Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layer | Te-Yuan Wu, Chia-Huei Lin, Hui-Min Wu, Kun-Che Hsieh, Kuan-Yu Wang +1 more | 2016-11-22 | $102,000 |
| 9502584 | Vertical diode and fabrication method thereof | Hsiung-Shih Chang, Manoj Kumar, Jui-Chun Chang, Chia-Hao Lee | 2016-11-22 | |
| 9391139 | Top-side contact structure and fabrication method thereof | Hsiung-Shih Chang, Jui-Chun Chang | 2016-07-12 |