Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9499399 | Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layer | Li-Che Chen, Te-Yuan Wu, Chia-Huei Lin, Kun-Che Hsieh, Kuan-Yu Wang +1 more | 2016-11-22 | $102,000 |