Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478513 | Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate | Jen-Yu Chen, Ting Yu Fu, Men Hsien Li | 2016-10-25 |
| 9349700 | Semiconductor device and method of forming stress-reduced conductive joint structures | Ming-Che Hsieh | 2016-05-24 |
| 9230896 | Semiconductor device and method of reflow soldering for conductive column structure in flip chip package | Li Chiun Hung | 2016-01-05 |