Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230896 | Semiconductor device and method of reflow soldering for conductive column structure in flip chip package | CHIEN-CHEN LEE | 2016-01-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230896 | Semiconductor device and method of reflow soldering for conductive column structure in flip chip package | CHIEN-CHEN LEE | 2016-01-05 |