TF

Ting Yu Fu

SC Stats Chippac: 1 patents #39 of 101Top 40%
Overall (2016): #202,944 of 481,213Top 45%
1
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9478513 Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate Jen-Yu Chen, Men Hsien Li, CHIEN-CHEN LEE 2016-10-25