Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418964 | Chip package structure | Wen-Yuan Chang, Yeh Hsu | 2016-08-16 |
| 9368454 | Semiconductor device with shielding layer in post-passivation interconnect structure | Chung-Hao Tsai, Chuei-Tang Wang, Chen-Hua Yu | 2016-06-14 |