Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425066 | Circuit substrate | Chen-Yueh Kung | 2016-08-23 |
| 9418964 | Chip package structure | Yeh Hsu, Wei-Chih Lai | 2016-08-16 |
| 9324580 | Process for fabricating a circuit substrate | Chen-Yueh Kung | 2016-04-26 |