Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449912 | Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming | Xueren Zhang, Kim-Yong Goh | 2016-09-20 |
| 9257372 | Surface mount package for a semiconductor integrated device, related assembly and manufacturing process | Kim-Yong Goh, Xueren Zhang, Kevin Formosa | 2016-02-09 |