Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449912 | Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming | Kim-Yong Goh, Roseanne Duca | 2016-09-20 |
| 9379034 | Method of making an electronic device including two-step encapsulation and related devices | Kim-Yong Goh, Yiyi Ma | 2016-06-28 |
| 9257372 | Surface mount package for a semiconductor integrated device, related assembly and manufacturing process | Roseanne Duca, Kim-Yong Goh, Kevin Formosa | 2016-02-09 |