Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9446943 | Wafer-level packaging of integrated devices, and manufacturing method thereof | Luca Maggi | 2016-09-20 |
| 9390988 | Method for soldering a cap to a support layer | Mark Anthony Azzopardi, Ivan Ellul | 2016-07-12 |
| 9257372 | Surface mount package for a semiconductor integrated device, related assembly and manufacturing process | Roseanne Duca, Kim-Yong Goh, Xueren Zhang | 2016-02-09 |
| 9253579 | Package for a MEMS sensor and manufacturing process thereof | — | 2016-02-02 |