Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9437573 | Semiconductor device and method for manufacturing thereof | Masataka Hoshino, Ryota Fukuyama | 2016-09-06 |
| 9418940 | Structures and methods for stack type semiconductor packaging | Masataka Hoshino, Masahiko Harayama, Koji Taya, Masanori Onodera, Ryota Fukuyama | 2016-08-16 |
| 9385014 | Flip-chip package covered with tape | — | 2016-07-05 |
| 9362173 | Method for chip package | Lei Shi, Yujuan Tao, Guohua Gao, Koichi Meguro | 2016-06-07 |
| 9293441 | Semiconductor device and method of manufacturing the same | Masataka Hoshino, Junichi Kasai, Kouichi Meguro, Ryota Fukuyama, Yasuhiro Shinma +2 more | 2016-03-22 |