Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9497862 | Packaging structure | Lei Shi, Guohua Gao, Guoji Yang, Honglei Li, Haijun Shen | 2016-11-15 |
| 9485868 | Package structure | — | 2016-11-01 |
| 9397070 | Method for forming package structure | — | 2016-07-19 |
| 9362173 | Method for chip package | Lei Shi, Guohua Gao, Naomi Masuda, Koichi Meguro | 2016-06-07 |
| 9324583 | Packaging method | Lei Shi, Guohua Gao, Jaingen Shi, Haiqing Zhu | 2016-04-26 |
| 9287205 | Fan-out high-density packaging methods and structures | Lei Shi | 2016-03-15 |