Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515010 | Semiconductor packaging structure and forming method therefor | Xin Xia, Wanchun Ding | 2016-12-06 |
| 9497862 | Packaging structure | Lei Shi, Yujuan Tao, Guoji Yang, Honglei Li, Haijun Shen | 2016-11-15 |
| 9362173 | Method for chip package | Lei Shi, Yujuan Tao, Naomi Masuda, Koichi Meguro | 2016-06-07 |
| 9324583 | Packaging method | Lei Shi, Yujuan Tao, Jaingen Shi, Haiqing Zhu | 2016-04-26 |