Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9457421 | Wire-bonding apparatus and method of wire bonding | Motoki Nakazawa, Yong Du | 2016-10-04 |
| 9379086 | Method of manufacturing semiconductor device | Shinji Kumamoto, Motoki Nakazawa, Yasuo Nagashima | 2016-06-28 |
| 9368471 | Wire-bonding apparatus and method of manufacturing semiconductor device | Shinichi Akiyama, Motoki Nakazawa | 2016-06-14 |
| 9337166 | Wire bonding apparatus and bonding method | Yoshihito Hagiwara, Koichi Takahashi, Yasuo Nagashima, Motoki Nakazawa | 2016-05-10 |