YD

Yong Du

SH Shinkawa: 1 patents #6 of 14Top 45%
📍 Tokyo, ID: #8 of 8 inventorsTop 100%
Overall (2016): #176,022 of 481,213Top 40%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9457421 Wire-bonding apparatus and method of wire bonding Naoki Sekine, Motoki Nakazawa 2016-10-04