Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379086 | Method of manufacturing semiconductor device | Shinji Kumamoto, Naoki Sekine, Motoki Nakazawa | 2016-06-28 |
| 9337166 | Wire bonding apparatus and bonding method | Yoshihito Hagiwara, Naoki Sekine, Koichi Takahashi, Motoki Nakazawa | 2016-05-10 |