Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9463997 | Composite particle, method of producing same, resin composition containing the particle, reflector formed from the composition, and light-emitting semiconductor device using the reflector | Yoshihiro TSUTSUMI | 2016-10-11 |
| 9449856 | Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus | Tomoaki Nakamura, Hideki Akiba, Susumu Sekiguchi | 2016-09-20 |
| 9401290 | Semiconductor apparatus and method for producing the same | Susumu Sekiguchi, Hideki Akiba | 2016-07-26 |
| 9397271 | UV- and heat-resistant optoelectronic semiconductor component | Harald Jaeger, Joerg Sorg, Tsutomu Kashiwagi | 2016-07-19 |
| 9312197 | Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus | Hideki Akiba, Tomoaki Nakamura, Shinsuke Yamaguchi | 2016-04-12 |
| 9287174 | Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus | Susumu Sekiguchi, Hideki Akiba, Tomoaki Nakamura | 2016-03-15 |
| 9268227 | UV-curable adhesive silicone composition, UV-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same | Tsutomu Kashiwagi | 2016-02-23 |
| 9240332 | Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus | Susumu Sekiguchi | 2016-01-19 |