Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449856 | Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus | Tomoaki Nakamura, Toshio Shiobara, Hideki Akiba | 2016-09-20 |
| 9401290 | Semiconductor apparatus and method for producing the same | Toshio Shiobara, Hideki Akiba | 2016-07-26 |
| 9287174 | Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus | Toshio Shiobara, Hideki Akiba, Tomoaki Nakamura | 2016-03-15 |
| 9240332 | Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus | Toshio Shiobara | 2016-01-19 |