Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449856 | Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus | Tomoaki Nakamura, Toshio Shiobara, Susumu Sekiguchi | 2016-09-20 |
| 9401290 | Semiconductor apparatus and method for producing the same | Toshio Shiobara, Susumu Sekiguchi | 2016-07-26 |
| 9312197 | Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus | Tomoaki Nakamura, Shinsuke Yamaguchi, Toshio Shiobara | 2016-04-12 |
| 9287174 | Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus | Susumu Sekiguchi, Toshio Shiobara, Tomoaki Nakamura | 2016-03-15 |