Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472438 | Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer | Kazunori Kondo, Hideto Kato, Shohei Tagami, Hiroyuki Yasuda | 2016-10-18 |
| 9458365 | Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same | Tae Hoon Kim, Hideto Kato, Jae-Hyun Kim, Jun-Won Han, Hiroyuki Yasuda +2 more | 2016-10-04 |
| 9365681 | Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method | Hideto Kato, Shohei Tagami | 2016-06-14 |
| 9346990 | Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same | Hiroyuki Yasuda | 2016-05-24 |
| 9334424 | Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer | Masahito Tanabe, Shohei Tagami, Hiroyuki Yasuda, Hideto Kato | 2016-05-10 |
| 9263333 | Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer | Hideto Kato, Shohei Tagami, Hiroyuki Yasuda, Masahito Tanabe | 2016-02-16 |