HY

Hiroyuki Yasuda

SC Shin-Etsu Chemical Co.: 5 patents #17 of 268Top 7%
HH Hitachi High-Technologies: 1 patents #175 of 444Top 40%
Honda Motor Co.: 1 patents #492 of 1,984Top 25%
Overall (2016): #14,548 of 481,213Top 4%
7
Patents 2016

Issued Patents 2016

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDate
9472438 Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer Kazunori Kondo, Hideto Kato, Michihiro Sugo, Shohei Tagami 2016-10-18
9458365 Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same Tae Hoon Kim, Hideto Kato, Jae-Hyun Kim, Jun-Won Han, Shohei Tagami +2 more 2016-10-04
9418825 Method and device for mass spectrometry Shinya Ito, Akira Fujii, Yasushi Terui 2016-08-16
9403459 Supporting unit structure of vehicle seat Takashi Kondo, Shinobu Sato, Naoyuki Saruwatari, Tomoyuki Honda, Tomomi Kitsugi 2016-08-02
9346990 Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same Michihiro Sugo 2016-05-24
9334424 Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer Masahito Tanabe, Michihiro Sugo, Shohei Tagami, Hideto Kato 2016-05-10
9263333 Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer Michihiro Sugo, Hideto Kato, Shohei Tagami, Masahito Tanabe 2016-02-16