Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9523155 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Hilton Diaz Camilo, Robert Rash +1 more | 2016-12-20 |
| 9476139 | Cleaning electroplating substrate holders using reverse current deplating | Lee Peng Chua, Steven T. Mayer, Santosh Kumar | 2016-10-25 |
| 9455139 | Methods and apparatus for wetting pretreatment for through resist metal plating | Bryan L. Buckalew, Steven T. Mayer, Robert Rash, Brian Paul Blackman, Doug Higley | 2016-09-27 |
| 9449808 | Apparatus for advanced packaging applications | Bryan L. Buckalew, Steven T. Mayer, David W. Porter | 2016-09-20 |
| 9412713 | Treatment method of electrodeposited copper for wafer-level-packaging process flow | Bryan L. Buckalew, Steven T. Mayer, David W. Porter | 2016-08-09 |
| 9359688 | Apparatuses and methods for controlling PH in electroplating baths | Lee Peng Chua, Mark L. Rea, Steven T. Mayer | 2016-06-07 |