Issued Patents 2016
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9523155 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Bryan L. Buckalew, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo, Robert Rash +1 more | 2016-12-20 |
| 9476139 | Cleaning electroplating substrate holders using reverse current deplating | Lee Peng Chua, Thomas A. Ponnuswamy, Santosh Kumar | 2016-10-25 |
| 9464361 | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating | David W. Porter | 2016-10-11 |
| 9455139 | Methods and apparatus for wetting pretreatment for through resist metal plating | Bryan L. Buckalew, Thomas A. Ponnuswamy, Robert Rash, Brian Paul Blackman, Doug Higley | 2016-09-27 |
| 9447505 | Wet etching methods for copper removal and planarization in semiconductor processing | Eric G. Webb, David W. Porter | 2016-09-20 |
| 9449808 | Apparatus for advanced packaging applications | Bryan L. Buckalew, David W. Porter, Thomas A. Ponnuswamy | 2016-09-20 |
| 9412713 | Treatment method of electrodeposited copper for wafer-level-packaging process flow | Bryan L. Buckalew, Thomas A. Ponnuswamy, David W. Porter | 2016-08-09 |
| 9404194 | Electroplating apparatus and process for wafer level packaging | David W. Porter | 2016-08-02 |
| 9394620 | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating | David W. Porter, Edwin Goh, Bryan L. Buckalew, Robert Rash | 2016-07-19 |
| 9385035 | Current ramping and current pulsing entry of substrates for electroplating | Tighe A. Spurlin, Jian Zhou, Edward C. Opocensky, Jonathan D. Reid | 2016-07-05 |
| 9359688 | Apparatuses and methods for controlling PH in electroplating baths | Lee Peng Chua, Thomas A. Ponnuswamy, Mark L. Rea | 2016-06-07 |
| 9309605 | Monitoring leveler concentrations in electroplating solutions | — | 2016-04-12 |
| 9309604 | Method and apparatus for electroplating | Jingbin Feng, Zhian He, Jonathan D. Reid, Seshasayee Varadarajan | 2016-04-12 |
| 9260793 | Electroplating apparatus for tailored uniformity profile | David W. Porter, Bryan L. Buckalew, Robert Rash | 2016-02-16 |