Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9523155 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo, Robert Rash +1 more | 2016-12-20 |
| 9469912 | Pretreatment method for photoresist wafer processing | Mark L. Rea | 2016-10-18 |
| 9455139 | Methods and apparatus for wetting pretreatment for through resist metal plating | Steven T. Mayer, Thomas A. Ponnuswamy, Robert Rash, Brian Paul Blackman, Doug Higley | 2016-09-27 |
| 9449808 | Apparatus for advanced packaging applications | Steven T. Mayer, David W. Porter, Thomas A. Ponnuswamy | 2016-09-20 |
| 9412713 | Treatment method of electrodeposited copper for wafer-level-packaging process flow | Steven T. Mayer, Thomas A. Ponnuswamy, David W. Porter | 2016-08-09 |
| 9394620 | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, David W. Porter, Edwin Goh, Robert Rash | 2016-07-19 |
| 9260793 | Electroplating apparatus for tailored uniformity profile | Steven T. Mayer, David W. Porter, Robert Rash | 2016-02-16 |