Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425130 | Package with multiple I/O side-solderable terminals | Chi Ho Leung, Wai Hung William Hor, Soenke Habenicht, WaiKeung Ho, Yee Wai Fung | 2016-08-23 |
| 9391007 | Built-up lead frame QFN and DFN packages and method of making thereof | Shun Tik Yeung, Chi Ho Leung, Kan Wae Lam, Chi Ling Shum | 2016-07-12 |