Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443791 | Leadless semiconductor package and method | Ke Xue, Soenke Habenicht, Wai Hung William Hor, San Ming Chan, Wai Keung Ng | 2016-09-13 |
| 9425130 | Package with multiple I/O side-solderable terminals | Wai Hung William Hor, Soenke Habenicht, Pompeo V. Umali, WaiKeung Ho, Yee Wai Fung | 2016-08-23 |
| 9391007 | Built-up lead frame QFN and DFN packages and method of making thereof | Shun Tik Yeung, Pompeo V. Umali, Kan Wae Lam, Chi Ling Shum | 2016-07-12 |