Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9391007 | Built-up lead frame QFN and DFN packages and method of making thereof | Shun Tik Yeung, Pompeo V. Umali, Chi Ho Leung, Chi Ling Shum | 2016-07-12 |
| 9269690 | Packaged semiconductor device with interior polygonal pads | Roelf A. J. Groenhuis, Clifford J. Lloyd, Chi Hoo Wan, Fei Ying Wong | 2016-02-23 |