Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418974 | Stacked semiconductor die assemblies with support members and associated systems and methods | Hong Wan Ng | 2016-08-16 |
| 9406660 | Stacked semiconductor die assemblies with die support members and associated systems and methods | Hong Wan Ng | 2016-08-02 |
| 9299684 | Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices | Chin Hui Chong | 2016-03-29 |