Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530748 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Choon Kuan Lee, David J. Corisis | 2016-12-27 |
| 9362260 | Stacked packaged integrated circuit devices, and methods of making same | David J. Corisis, Choon Kuan Lee | 2016-06-07 |
| 9362141 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices | David J. Corisis, Choon Kuan Lee | 2016-06-07 |
| 9355994 | Build-up package for integrated circuit devices, and methods of making same | Hong Wan Ng, Choon Kuan Lee, David J. Corisis | 2016-05-31 |
| 9355992 | Land grid array semiconductor device packages | Lee Choon Kuan, David J. Corisis | 2016-05-31 |
| 9299684 | Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices | Seng Kim Ye | 2016-03-29 |
| 9271403 | Semiconductor assemblies with multi-level substrates and associated methods of manufacturing | Hong Wan Ng | 2016-02-23 |