Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418974 | Stacked semiconductor die assemblies with support members and associated systems and methods | Seng Kim Ye | 2016-08-16 |
| 9406660 | Stacked semiconductor die assemblies with die support members and associated systems and methods | Seng Kim Ye | 2016-08-02 |
| 9355994 | Build-up package for integrated circuit devices, and methods of making same | Choon Kuan Lee, David J. Corisis, Chin Hui Chong | 2016-05-31 |
| 9271403 | Semiconductor assemblies with multi-level substrates and associated methods of manufacturing | Chin Hui Chong | 2016-02-23 |