| 9514975 |
Semiconductor with through-substrate interconnect |
Kunal R. Parekh |
2016-12-06 |
| 9508628 |
Semiconductor substrates with unitary vias and via terminals, and associated systems and methods |
Kunal R. Parekh |
2016-11-29 |
| 9484378 |
Semiconductor devices including back-side integrated circuitry |
Steve Oliver |
2016-11-01 |
| 9449906 |
Devices, systems, and methods related to forming through-substrate vias with sacrificial plugs |
Kunal R. Parekh |
2016-09-20 |
| 9343368 |
Disabling electrical connections using pass-through 3D interconnects and associated systems and methods |
Jeffery W. Janzen, Michael Chaine, William M. Hiatt |
2016-05-17 |
| 9343362 |
Microelectronic devices with through-silicon vias and associated methods of manufacturing |
Kunal R. Parekh, Philip J. Ireland, Sarah A. Niroumand |
2016-05-17 |
| 9305865 |
Devices, systems and methods for manufacturing through-substrate vias and front-side structures |
Anurag Jindal, Jian He, Lalapet Rangan Vasudevan, Hongqi Li |
2016-04-05 |
