Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9347985 | Via chain testing structure and method | Wen-Sung Chiang | 2016-05-24 |
| 9343362 | Microelectronic devices with through-silicon vias and associated methods of manufacturing | Kyle K. Kirby, Kunal R. Parekh, Sarah A. Niroumand | 2016-05-17 |
| 9287184 | Apparatuses and methods for die seal crack detection | Charles H. Dennison, Kenneth W. Marr, Deepak Thimmegowda | 2016-03-15 |