Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9396995 | MOL contact metallization scheme for improved yield and device reliability | Suraj K. Patil, Min-hwa Chi, Wen-Pin Peng | 2016-07-19 |
| 9385124 | Methods of forming reduced thickness spacers in CMOS based integrated circuit products | Wen-Pin Peng, Min-hwa Chi | 2016-07-05 |
| 9318440 | Formation of carbon-rich contact liner material | Huy Cao, Songkram Srivathanakul, Huang Liu, Boaz Alperson | 2016-04-19 |