Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287110 | Method and apparatus for wafer electroless plating | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, John Parks +5 more | 2016-03-15 |
AO
Aleksander Owczarz
Overall (2016): #472,236 of 481,213Top 100%
1
Patents 2016