Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287110 | Method and apparatus for wafer electroless plating | William Thie, John M. Boyd, Fritz Redeker, Yezdi Dordi, Tiruchirapalli Arunagiri +5 more | 2016-03-15 |
JP
John Parks
Overall (2016): #345,663 of 481,213Top 75%
1
Patents 2016