Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9359673 | Apparatus and method for atomic layer deposition | Hyungsuk Alexander Yoon, Mikhail Korolik, John M. Boyd, Yezdi Dordi | 2016-06-07 |
| 9287110 | Method and apparatus for wafer electroless plating | William Thie, John M. Boyd, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more | 2016-03-15 |