Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490198 | Transmitting and receiving package | — | 2016-11-08 |
| 9462736 | Composition and methods of forming solder bump and flip chip using the same | Jong Tae Moon, Sangwon OH, KeonSoo JANG | 2016-10-04 |